Device: M25PX64-V [TBGA24]
Manufacturer: Micron
Part number description for this device:
Move the cursor over the box to highlight particular section| M | Numonyx | |
| XXXX | Family Descriptor | 25P = SPI serial Flash EEPROM 25PE = Page-Erasable serial flash memory 25F = Serial Flash memory, 4-Kbyte and 64-Kbyte erasable sectors 25PX = Serial Flash memory, 4-Kbyte and 64-Kbyte erasable sectors, dual input/output 45PE = Page-Erasable serial flash memory |
| XX | Density | 05 = 512 kbit 10 = 1 Mbit 20 = 2 Mbit 40 = 4 Mbit 80 = 8 Mbit 16 = 16 Mbit 32 = 32 Mbit 64 = 64Mbit 128 = 128Mbit |
| XX | Security Features | - = no extra security SO = OTP configurable + CFD programmed with UID ST = OTP configurable + protection at power up + CFD programmed with UID S- = CFD programmed with UID |
| X | Operating Voltage | AV = 2.7V to 3.6V enhanced technology V = 2.3V to 3.6V (for M25P10A, M25P40) V = 2.7V to 3.6V |
| XX | Package Type | BA = PDIP8 (300mil) MC = UFDFPN8 (MLP8 4x3mm) MN = SO8 (150mil) MW = SO8W (200mil) MF = SO16 (300mil) ME = VDFPN8 (MLP8 8x6mm) MD = VDFPN8 (MLP8 8x6mm), with reduced D2 dimension MP = VFQFPN8 (MLP8 6x5mm) DW = TSSOP8 (170mil) ZW, MB = UFDFPN8 (MLP8 2x3mm) ZM = TBGA24 (6x8mm) |
| X | Temperature Range | 6 = Industrial (-40°C to 85°C) 3 = Automotive (-40°C to 125°C) |
| X | Option | Blank = Standard packing T = Tape&Reel Packing E = Standard packing ECOPACK® (RoHS compliant) F = Tape&Reel Packing ECOPACK® (RoHS compliant) |
| X | Plating Technology | Blank = Standard SnPb plating P, G = ECOPACK® (RoHS compliant) |
| X | Lithography | Blank = 110nm B = 110nm, Fab.2 diffusion plant |
| / | ||
| X | Automotive Grade | Blank = Standard (-40°C to 85°C) A = Automotive (-40°C to 125°C), device tested with high reliability certified flow |
| X | Process | X = T7Y Y = T7Y redesigned |
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
go back to result pageSupported by programmers and programming adapters/modules:
| BeeHive204 | adapter/module: DIL8/BGA24-2 ZIF-CS SFlash-1 (70-3095) |
| BeeHive204AP | adapter/module: AP1 BGA24-2 ZIF SFlash-1b (71-5481) OR AP1 BGA-1114/1197 (discontinued) |
| BeeHive208S | adapter/module: DIL8/BGA24-2 ZIF-CS SFlash-1 (70-3095) |
| BeeHive304 | adapter/module: AP3 BGA24-2.02 SFlash-1 (73-6196) OR AP3 BGA24-2 SFlash-1 (discontinued) |
| BeeProg2 | adapter/module: DIL8/BGA24-2 ZIF-CS SFlash-1 (70-3095) |
| BeeProg2AP | adapter/module: AP1 BGA24-2 ZIF SFlash-1b (71-5481) OR AP1 BGA-1114/1197 (discontinued) |
| BeeProg2C | adapter/module: DIL8/BGA24-2 ZIF-CS SFlash-1 (70-3095) |
| BeeProg3 | adapter/module: AP3 BGA24-2.02 SFlash-1 (73-6196) OR AP3 BGA24-2 SFlash-1 (discontinued) |
| BeeHive204AP-AU (discontinued) | adapter/module: AP1 BGA24-2 ZIF SFlash-1b (71-5481) OR AP1 BGA-1114/1197 (discontinued) |
